| 摘要 |
PROBLEM TO BE SOLVED: To form a metal surface layer, which is finely roughened and is subjected to conversion coating, and to promote interlayer adhesion at the time of the manufacture of a multilayered PCB layer by a method, wherein the metal surface layer is brought into contact with an adhesion accelerating composition containing hydrogen peroxide, an inorganic acid, an organic corrosion inhibitor and a surface agent, which respectively have a specified concentration. SOLUTION: A surface conductive layer, which is a metal surface layer, is brought into contact with an adhesion accelerating composition containing hydrogen peroxide, an inorganic acid, and organic corrosion inhibitor and a surface active agent, which respectively have 0.1 to 20 wt.% of a concentration, in an adhesion acceleration state for forming the metal surface layer which is finely roughened and is subjected to conversion coating. As the inorganic acid in the composition, sulfuric acid is especially preferable, as the inhibitor, triazol is preferable, and as the organic corrosion inhibitor benzotriazol substituted depending on the case is especially preferable. the most preferable one as the surfactant is a surfactant consisting of quaternary ammonium, and one or more kinds of ethoxidated fatty amines are preferable. |
