发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device capable of cutting off noise generated from a semiconductor circuit formed on a board. SOLUTION: The semiconductor device 1 comprises an acceleration sensor 3 formed on a board 2, a conductive frame 7, an insulating film 10 and a conductive shield film 11. The sensor 3 has an oscillator 4 and a detector 6. The frame 7 is so formed on the board 2 as to surround the peripheries of the oscillator 4 and the detector 6. The film 10 is so formed as to cover the oscillator 4, and the detector 4 from the surface. A through groove 10A is formed at the forming position of the frame 7 on the film 10. The film 11 is so provided as to cover the film 10, and so gradually formed in the state as to be electrically conducted with the frame 7 via the groove 10A.
申请公布号 JPH0961456(A) 申请公布日期 1997.03.07
申请号 JP19950243597 申请日期 1995.08.29
申请人 MURATA MFG CO LTD 发明人 NAKAMURA HIDEAKI
分类号 G01P15/12;H01L29/84;H05K9/00;(IPC1-7):G01P15/12 主分类号 G01P15/12
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