发明名称 PRINTED WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To obtain a flexible printed wiring board wherein a board surface (flat part) capable of mounting an IC or a chip component is more increased. SOLUTION: A printed wiring board 1, in which a bending part 3 to be bent and warped and flat parts 1a, 1b on which mounting components are loaded are formed, is provided with a notch 3b in the bending part 3, so that the areas of the flat parts 1a, 1b on which mounting components are loaded are increased.</p>
申请公布号 JPH0992937(A) 申请公布日期 1997.04.04
申请号 JP19950245877 申请日期 1995.09.25
申请人 MITSUBISHI ELECTRIC CORP 发明人 MIZUTANI YOSHITAKA;WASHIDA TETSUO
分类号 B42D15/10;H05K1/00;H05K1/02;H05K1/18;H05K3/34;(IPC1-7):H05K1/02 主分类号 B42D15/10
代理机构 代理人
主权项
地址