| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor-wafer junction device, by which wafers can be joined with reliability and the two joined wafers are laid down on a specified junction board. SOLUTION: This semiconductor-wafer junction device contain a stepping motor, a first roller 101 and a second roller 102 installed on the same axis and rotated in the mutually opposite directions by the above-mentioned stepping motor, and a first junction board 103 and a second junction board 104, which are fixed onto the first roller 101 and the second roller 102 respectively and on which wafer are placed. A plurality of trenches 103d, 104d are formed to the surfaces of the first junction board 103 and the second junction board 104 resepectively. Accordingly, the wafers can be joined with reliability, and the joined wafers are laid down on the specified junction boards at all times.</p> |
