HEAT RADIATOR FOR INTEGRATED CIRCUIT DEVICE, MEMBER PROVIDED THEREWITH, AND HEAT PIPE

摘要

PROBLEM TO BE SOLVED: To enhance a heat radiator not only in heat dissipating properties but also in manufacturability by a method wherein a silicone rubber layer which is prescribed in thickness and contains at least thermally conductive filler is provided between a metal plate and a heat pipe. SOLUTION: A heat pipe 1 is mounted onto and fixed to a member composed of a metal plate which includes a fixing means and comes into contact with at least the heat pipe 1 and a silicone rubber layer 2 which contains thermally conductive filter, is 0.1 to 5mm in thickness, and formed on the metal plate. Heat released from an integrated circuit device 4 kept in operation is conducted to a heat plate 3. Heat is efficiently discharged out through the silicone rubber layer 2 and the heat pipe 1. As mentioned above, a heat radiator of this constitution is excellent in heat dissipating properties and capable of being enhanced in manufacturability because a heat pipe is hardly broken down even if a caulking pressure applied to it is enhanced when the heat pipe is mounted in a manufacturing process.