| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board manufacturing method which enables arbitrary wiring among an outer layer and adjacent double inner layers by forming blind holes at a high density. SOLUTION: Through-holes are bored through a double-sided Cu-clad laminated board, a circuit is formed on one face of this board, an insulating adhesive sheet is laminated on an inner layer sheet having a formed circuit, the laminated board is placed on the outside of the adhesive sheet with the circuit inside and hot pressed to a unified laminate, a laser beam is applied to the unified multilayer printed wiring board to remove a resin only in holes of the outer layer Cu foil, through-holes are bored, if required, the through-holes and blind holes bored by the laser beam are plated to interconnect the layers and the outer Cu foil is etched to form a circuit. |
