发明名称 半導体素子およびその製造方法
摘要 A semiconductor device includes a first silicon carbide semiconductor layer of a first conductive type that is positioned on a front surface of a substrate of the first conductive type, a transistor region that includes transistor cells, a Schottky region, and a boundary region. The boundary region includes a second body region and a gate connector that is arranged on the second body region via an insulating film and electrically connected with a gate electrode. The Schottky region includes a Schottky electrode that is arranged on the first silicon carbide semiconductor layer.
申请公布号 JP6021032(B2) 申请公布日期 2016.11.02
申请号 JP20150096524 申请日期 2015.05.11
申请人 パナソニックIPマネジメント株式会社 发明人 内田 正雄;楠本 修;堀川 信之
分类号 H01L27/04;H01L29/06;H01L29/12;H01L29/47;H01L29/78;H01L29/872 主分类号 H01L27/04
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