| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate dust after cleaning from a wafer surface by cleaning the surface, with the surface, on which a device is formed, down. SOLUTION: A wafer cleaning device 1 has a wafer 11 of which rear surface, which is the upper surface of the wafer, is sucked and held by a vacuum chuck 7 and of which upper surface 15 is down. A brush 21 is driven to rotate by a brush rotating axis 27 which is extended from the center of the lower surface to the lower direction. A flow passage for cleaning liquid is provided at the inner part of the brush 21 and the rotating axis 27. Such cleaning liquid as ultrapure water is supplied from the rotating axis 27 to the brush 21 and transferred from the inside of brush bristles on the upper surface of the brush 21 to the lower portion of the surface 15 of the wafer 11. By the means such dust which is brushed and taken off and as dust on the wafer surface can be eliminated together with the cleaning liquid during the cleaning processing. Even if dust from the air of a clean room and so on falls on the wafer during the cleaning processing, it to adheres to the rear surface only.</p> |
