| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a flexible wiring board having no void and excellent in surface smoothness dimensional stability and thickness accuracy at high productivity while contributing to cost reduction. SOLUTION: A flexible inner layer circuit board 1 previously formed with a circuit is applied, to the opposite sides thereof, with resin insulation layers 2 of the same thickness as the inner layer circuit and then it is planarized. Subsequently, a flexible single side copper clad plate 4 provided with an adhesive layer 6 on the film side is applied to each side of the flexible inner layer circuit board 1 such that the adhesive layer 6 touches the inner layer circuit 3. Finally, it is hot pressed integrally to produce a multilayer flexible wiring board. |
