发明名称 Method and apparatus for fabricating semiconductor device with photodiode
摘要 On a surface of a silicon substrate, N+ type buried layer and N-type epitaxial layer are formed in order, and an isolation layer reaching the silicon substrate from the surface of the N-type epitaxial layer is formed to define a photodiode. In the surface of the photodiode, a rectangular recess is selectively formed toward inside of the N-type epitaxial layer. On the side face of the recess, a silicon oxide layer is formed. In the region surrounded by the silicon oxide layer, a photo absorbing layer and so forth is formed. On the other hand, in an optical waveguide, a LOCOS oxide layer is formed toward inside from the surface of the N-type epitaxial layer. The N-type epitaxial layer is sandwiched between the LOCOS oxide layer and the N+ type buried layer. The refraction indexes of the LOCOS oxide layer and the N+ type buried layer are smaller than that of the N-type epitaxial layer. Thus, the N-type epitaxial layer serves as an optical passage to efficiently introduce a light beam into the photo absorbing layer of the photodiode.
申请公布号 US5747860(A) 申请公布日期 1998.05.05
申请号 US19960613077 申请日期 1996.03.08
申请人 NEC CORPORATION 发明人 SUGIYAMA, MITSUHIRO;TASHIRO, TSUTOMU
分类号 G02B6/42;H01L31/0232;H01L31/0352;H01L31/103;H01L31/18;(IPC1-7):H01L31/023 主分类号 G02B6/42
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