| 摘要 |
PROBLEM TO BE SOLVED: To reduce influence of inductance or the like in a connection part of ground, and make the ground level uniform, in a semiconductor device wherein a circuit board on which a semiconductor chip for pseudo-millimetric wave- millimetric wave and a circuit board are mounted on a mother board. SOLUTION: A microstrip line constituted of a ground layer 2, a dielectric film 3 composed of a BCB film (benzo cyclo butene film), and a wiring layer 4 is formed on a circuit board 11 mounted on a mother board 12. A semiconductor chip 7 including a high frequency transistor is mounted on the circuit board 11. The peripheral part of the dielectric film 3 is eliminated, and the peripheral part of the ground layer 2 is exposed. A ground terminal 13 is formed almost the whole surface of the mother board 12. The exposed region of the ground layer 2 is connected with the ground terminal 13, through many conducting wires 14. Influence of inductance or the like in connection parts is excluded, and the ground level of the circuit board and the mother board is made uniform, so that characteristics expected by design can be obtained. |
