| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of microscopic waviness by performing grinding work by moving either one of a disk substrate or a peripheral cutting edge grinding wheel so that side cut work and spark out work are successively and continuously performed on the disk substrate while rotating the peripheral cutting edge grinding wheel and the disk substrate. SOLUTION: In work, first of all, a side cut work part A performs depth directional grinding of a disk substrate 12 for the purpose of rough grinding, and about 80% of the whole work quantity is removed here. Next, a dimension producing work part B is the so-called plane grinding part, but dispersion of a thickness is controlled to about 1μm by grinding in this part B, and lastly, the work is finished by performing spark out work (leveling work) to remove a locus (microscopic waviness) of a grinding wheel caused by the work by a spark out work part C.
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