| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a holding tool of a semiconductor chip for holding a semiconductor chip in a wide range by preventing a chuck face from being brought into face-contact with the surface of the semiconductor chip in holding the semiconductor chip. SOLUTION: In a collet 21, the absorption face of the lower edge part of a collet body 2 is formed of a recessed curved face 7 having curvature, only in one direction (an arrow A-direction). Also, a vacuum suction hole 5 is formed at almost the central part of the chuck face. In the case of holding a semiconductor chip 6 by the collet 21, the two faced ridge lines of the semiconductor chip 6 are brought into line-contact in the recessed curved face 7, and the semiconductor chip 6 is chucked. Thus, even when the positions of the chuck face and the semiconductor chip are shifted much, the chip surface can be prevented from being brought into face-contact with the chuck face, and the contaminations or damages of a wiring pattern or passivation film or the like formed on the chip surface can be prevented.</p> |
