| 摘要 |
PROBLEM TO BE SOLVED: To unneccesitate transportation mechanism of a mold, to shorten a transportation time of a mold, and to miniaturize a mold by transporting a substrate coated with hardened type resin to a mold of a mold holding mechanism, placing an application plane so as to oppose to a mold, hardening hardened type resin held between the mold and the substrate, and peeling off hardened resin from the mold with the substrate. SOLUTION: A transportation mechanism 1 is attached to an arm 11 freely rotatably held on a holding mount 10 by a shaft and a peeling off mechanism 4 is attached to an arm 41 freely rotatably held on a holding mount 40 by a shaft. The device is constituted so that the transportation mechanism 1 and the peeling off mechanism 4 are alternately driven and a hardening mechanism 3 can be transferred to a position at which operations of these arms 11, 41 are not prevented during operation of any of other mechanisms. Also, a mold 103 is fixed in a seal up container 20 of a mold holding mechanism 2, the transportation mechanism 1 and the peeling off mechanism 4 placed at an opposing position each other can carry in and carry out the substrate by the arms 11, 41. Releasing and operation of a fixing mechanism of the mold 103 are not required to be repeated. |
