Electronic device with a microcircuit accommodated in a housing

摘要

A microcircuit (3) is accommodated in a housing (1) which consists of a metal, e.g. aluminium, which in the case of electrolytic treatment forms on its surface a dielectric oxidation layer (2). On the inside of the housing (1) there is such an oxidation layer (2) on which the circuit parts (4-16) of the microcircuit (3) are mounted. The housing (1) thus serves at the same time as a support member for the microcircuit (3). As a result, effective thermal dissipation is ensured from the circuit elements (4-16) to the housing exterior.