| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the resistance of an inductor, by forming a coil of a wiring provided at each layer having an insulating film and a thin film wiring at the same position of the each layer with its part or entire area as the same pattern, providing a via hole for coupling the layers at both ends of the wiring, and wiring-connecting the layers. SOLUTION: A thin film wiring 2 and an outgoing wiring thin film (first layer thin film wiring) 2 are formed on a first layer insulating film 5 provided on a semiconductor substrate. The film 5 and the wiring 2 of the first layer are covered with a second layer insulating film 4 by a CVD method or the like, and a spiral second layer thin film wiring 1 of substantially the same pattern as the first layer spiral thin film wiring is formed on the film 4 by a step of sputter etching or the like. Via holes 3 for coupling the outgoing and both layers are formed by etching at a center of the wiring 1 and both ends of the wiring having the same first and second wiring patterns, and wiring- connected at a step of sputtering.</p> |
