| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip resistor manufacturing method with which the yield of the product can be improved by enabling it to immediately confirm abnormalities, when such abnormalities as the output drop in a laser, etc., occurs at trimming time. SOLUTION: A glass layer 2 of a color which is different from that of an insulating substrate 1 is formed on the upper surface of the substrate 1, and a resistor layer 3 is formed on the upper surface of the glass layer 2. Then, after electrode layers 4 have been formed so that parts of the layers 4 are connected to both ends of the resistor layer 3, a desired resistance value is obtained by trimming the layer 3 and underlying glass layer 2 at an arbitrary spot, until the upper surface of the substrate 1 is exposed, and finally, a protective film 7 is formed to cover the entire body of the resistance layer 3.</p> |
