| 摘要 |
<p>PROBLEM TO BE SOLVED: To narrow a pitch connecting to an electrode of a semiconductor chip by a method wherein more than one lead, one end of which is fixed to an electrode of a semiconductor chip and the other end is fixed to a wiring of a circuit board by pressure bonding by ultrasonic wave vibration, are provided. SOLUTION: Before lead bonding, a tape carrier 3 is piled up on a circuit board by positioning, and each conductive lead 2 is overlaid on each wiring 11 of the circuit base 10. And, a semiconductor chip 4 is fixed to the tape carrier 3, and the semiconductor 4 is pressure bonded to a wiring 11 of the circuit board 10 that constitutes an electronic device by such a manner that each one of the lead 2 is cut by a cut blade 6 a bonding tool 5, also a cut end 7 of the lead is pressure bonded, or pressure bonded accompanied by heat and ultrasonic vibration on a pressure bonding face 9 of the bonding tool 5. By this construction, a pitch of each one of the lead 2 is narrowed, and an installation area and be reduced.</p> |
