| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric cooling module which is high in reliability and adequate for cooling performance to cope with various electronic equipment. SOLUTION: A thermoelectric cooling module 1 is formed in a manner such that a large number of through-holes 3 are provided to an electrical insulating base 2, P-type thermoelectric semiconductor elements 4p and N-type thermoelectric semiconductor elements 4n are separately provided inside the through-holes 3, and the P-type thermoelectric semiconductor elements 4 and the N-type thermoelectric semiconductor elements 4n are connected alternately, together with front-side electrodes 5 which are each formed on the surface of the base 2 and the inner wall of the through-hole 3 so as not to penetrate through the base 2, and rear-side electrodes 6 which are each formed on the rear of the base 2 and the inner wall of the through-hole 3 so as not to penetrate through the base 2. |
