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发明名称
LIQUID CRYSTAL POLYMER ENCAPSULANT
摘要
<p>Molding compounds for encapsulating electronic components are disclosed. The molding compounds employ liquid crystal polymer resins and fillers coated with non-polar silane coupling agents to reduce the viscosity of the compounds.</p>
申请公布号
WO2000002975(A1)
申请公布日期
2000.01.20
申请号
US1999015095
申请日期
1999.07.02
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发明人
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