| 摘要 |
PURPOSE: A chip carrier and manufacturing method of an integrated circuit is provided to reduce a possibility that the integrated circuit located on the chip carrier is to be damaged. CONSTITUTION: The method comprises the steps of: providing an integrated circuit(150); providing the chip carrier including a base(115), an inner well(120) formed at periphery of the base, and an outer well(125) formed at periphery of the inner well; and locating the integrated circuit on the base. The chip carrier has a double well structure including the inner well and the outer well. The double well structure takes a flexible structure absorbing a power produced by an impact. To preventing a crush from generating by the impact, the outer well is deeper than the inner well. Thereby, it is possible to prevent the integrated circuit located on the chip carrier from damaging.
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