发明名称 NEGATIVE ELECTRODE STRUCTURE
摘要 <p>PROBLEM TO BE SOLVED: To improve the reliability while eliminating the generation of camber of a substrate by providing a heater formed in one surface of the substrate, a surface layer formed in the other surface of the substrate, a substrate metal formed in the surface of this surface layer and formed of a metal sintered body, and a negative electrode substrate coated with the substrate metal. SOLUTION: One surface 21a of a substrate 21 formed of APBN is provided with a heater 22 formed of an APG thick film with a meandering pattern, and the other surface 21b of the substrate 21 is provided with a surface layer 23a for substrate metal formed of the APG thick film at a central part of the substrate, and a surface layer 23b for terminal is formed in both ends of the substrate. A substrate metal 24 formed of a nickel sintered body is arranged for bonding in a surface of the surface layer 23a, and furthermore, the electron emitting material such as barium carbonate and strontium carbonate is coated by spraying. The substrate metal of the negative electrode substrate absorbs a difference of the thermal expansion between the substrate and the substrate metal so as to prevent the generation of camber of the substrate and the peeling of the substrate metal.</p>
申请公布号 JP2000133115(A) 申请公布日期 2000.05.12
申请号 JP19980310690 申请日期 1998.10.30
申请人 TOSHIBA CORP;TOSHIBA ELECTRONIC ENGINEERING CORP 发明人 KOBAYASHI KAZUO;SUDO TAKASHI;TOKUE HIROSHI;TAKAHASHI HIDEJI
分类号 H01J1/20;H01J1/22;H01J1/24;H01J1/26;H01J29/04;(IPC1-7):H01J1/26 主分类号 H01J1/20
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