| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat radiation characteristic and the electromagnetic shield effect by pasting a member having approximately the same thermal expansion coefficient as a semiconductor chip to a functional part of a semiconductor to form a heat conductive path to outside, and forming an electromagnetic shield layer on a parallel surface of the member contacting the semiconductor chip surface. SOLUTION: A heat conductive member 1 composed of an Si chip, Kovar, ceramic material, etc., having approximately the same thermal expansion coefficient as a semiconductor chip 4 is directly pasted to a functional part of a semiconductor, and an insulative adhesive 3 (liq. adhesive contg. ceramic grains and having a glass transition temp. of 30 deg.C or less) is filled and hardened to adhere the heat conductive member 1 to the semiconductor chip 4, thereby forming a heat conductive path to outside. A metal thin film structure 2 is provided on one surface of the conductive member 1 near the chip 4 and on the opposite surface. Thus, it is possible to lower the heating temp. of the semiconductor chip and suppress the characteristic variation of the semiconductor chip due to electromagnetic waves, ultrasonic/infrared rays, etc. |
