发明名称 PHENOLIC RESIN MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a phenolic resin molding material which has high mechanical strengths, good electrical insulating properties and excellent sliding characteristics. SOLUTION: The phenolic resin molding material comprises, as essential ingredients, a high-molecular phenolic novolak resin having a number average molecular weight of 1,000-1,500, a fine powder of a polytetrafluoroethylene resin and a polyimide powder, and contains 5-40 wt.% of the fine powder of a polytetrafluoroethylene resin and 1-5 wt.% of the polyimide powder based on the whole molding material.
申请公布号 JP2000226495(A) 申请公布日期 2000.08.15
申请号 JP19990029544 申请日期 1999.02.08
申请人 TOSHIBA CHEM CORP 发明人 AKIMOTO HIROSHI;ASAMI KENJI;NAKAJIMA YUKINORI
分类号 C08L61/08;(IPC1-7):C08L61/08 主分类号 C08L61/08
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