| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a water-soluble working oil for cutting a silicon ingot, not causing stain on the surface of a wafer after working, having slight danger of ignition, etc., and improved operation efficiency by making the working oil include fine powder selected from a metal oxide and silicon oxide. SOLUTION: This working oil contains preferably 0.01-10.0 wt.% of one or more kinds of fine powders selected from a metal oxide such as alumina, titanium oxide, zinc oxide and silicon oxide. The water-soluble working oil for cutting a silicon ingot is preferably constituted of (A) 0.01-10.0 wt.% of one or more kinds of fine powders selected from the metal oxide such asγ-alumina and silicon oxide, (B) 0.5-3.0 wt.% of laminar clay mineral, (C) 63-90 wt.% of a water-soluble solvent and (D) 9-30 wt.% of water.</p> |
