发明名称 METHOD FOR CORRECTING PITCH WIDTH OF KNIFE BY PLATING
摘要 PROBLEM TO BE SOLVED: To correct the pitch width between knives to high precision without requiring precise calibration by polishing and a shim, by forming a metallic coating film on the joint face between the knives by plating. SOLUTION: Since the thickness of plating can be decided in accordance with plating time, from the state in which the edge width of knives before correcting is set to the minus precision, a coating film is formed by plating, and the edge width can be corrected. At this time, the precision of the plating lies within±0.3μm, so that the correction of the edge width of the knives can be executed also at the precision within±0.3μm. Thus, in the case they are applied to a cutting machine composed of an upper edge 8 and a lower edge 10, the precision of the pitch P of the respective edge width can be set to the high precision within±0.3μm. In this way, e.g. the width of magnetic tape in the producing stage is made with high precision, and moreover, its cutting can be executed with high reliability.
申请公布号 JP2000303187(A) 申请公布日期 2000.10.31
申请号 JP19990109809 申请日期 1999.04.16
申请人 SONY CORP 发明人 MATSUTANI SHUHEI
分类号 B26D1/00;B26D1/24;C23C18/32;C23C28/02;(IPC1-7):C23C18/32 主分类号 B26D1/00
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