发明名称 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide epoxy resin compositions capable of sharply reducing a carbon black agglomerate which secondarily forms. SOLUTION: Epoxy resin compositions contain, as the essential components, an epoxy resin, a phenolic resin, an inorganic filler, a curing accelerator, and a carbon black containing particles having a particle diameter of not smaller than 45μm in an amount of not greater than 500 ppm and having a maximum particle diameter of not greater than 500μm, with an amount of the carbon black being 0.1-1.0 wt.% based on the entire epoxy resin composition.
申请公布号 JP2001019833(A) 申请公布日期 2001.01.23
申请号 JP19990191891 申请日期 1999.07.06
申请人 SUMITOMO BAKELITE CO LTD 发明人 FUJITA HIROSHI;MAEDA MASAKATSU
分类号 C08L63/00;C08K3/00;C08K3/04;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 主分类号 C08L63/00
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