发明名称 CHUCK DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To obtain a chuck device capable of chucking an insulative substrate. SOLUTION: A first and a second electrode 11, 12 are exposed and disposed on a base 10 having an insulated surface so that an insulative substrate is disposed in contact with or close to the first and second electrode surfaces. An electric field having a spatial change ratio is formed between the first and second electrodes 11, 12 and hence the substrate 7 is chucked to the chuck device 1 surface due to the gradient force. The gradient force value depends on the change ratio value of the electric field and hence a voltage is applied between the first and second electrodes 11, 12 enough to form an electric field of 1.0×106 V/m or more.</p>
申请公布号 JP2001035907(A) 申请公布日期 2001.02.09
申请号 JP19990210192 申请日期 1999.07.26
申请人 ULVAC JAPAN LTD 发明人 FUWA KO;MAEHIRA KEN
分类号 C23C14/50;H01L21/205;H01L21/683;(IPC1-7):H01L21/68 主分类号 C23C14/50
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