| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip tray to realize the fact that bumps are mounted on chips in a state such that the individual chips are housed in the chip tray to form flip chips and a flip chip forming method. SOLUTION: A protrusion 2 protruded to the side of the surface of a chip tray 1 is formed on the region provided with chip housing recess 5 formed in the surface of the tray 1,on the surface of the tray 1 and through holes 6 for vacuum chuck penetrated in the backside of the tray 1 are opened in the inner bottoms of the recesses 5. Chips 11 are put in the recesses 5, the chips are vacuum-chucked from the backside of the tray 1 into the recesses 5 through the holes 6, a flux 32 is applied on the upper surfaces of the chips on the tray 1, metal balls 12 are mounted on the upper surfaces of the chips 11, the tray and the chips are heated, the balls are reflowed to bond to pads on the chips and flip chips 11A are formed.</p> |
