| 摘要 |
<p>PROBLEM TO BE SOLVED: To materialize a semiconductor device which can reduce on-resistance, without marring the low on resistance property of a semiconductor pellet by reducing as far as possible the electric resistance of the internal connection part. SOLUTION: A semiconductor pellet 1, where a first electrode 2 is made on rear and second and third electrodes 3 and 4 different in area are made on the surface, is mounted on an island 5, and a plurality of leads 8 and 12 are arranged along the two sides, at least of this island 5, and the second electrode 3 of small area is connected to one lead (8a), and the third electrode 4 is connected to remaining leads (8b) dispersedly, and the principal part including the semiconductor pellet 1 is covered with a resin 1.</p> |
