发明名称 MASK FOR ELECTRON BEAM EXPOSURE AND MANUFACTURE THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To make formation of a fine pattern compatible with improvement of mechanical strength. SOLUTION: A mask l for electron beam exposure consists of a board part 2 on which apertures 3 are formed, and a thin-film part 4 retained with the board part 2. On the thirrfilm part 4, a thin semiconductor active film (first semiconductor film) 6A and a thick semiconductor active film (second semiconductor film) 6B thicker than the film 6A are formed. A fine pattern part 7A, having small diameter apertures 8A, is formed on the thin semiconductor active film 6A, and a large dimensional pattern part 7B having large diameter apertures 8B is formed on the thick semiconductor active film 6B.</p>
申请公布号 JP2001044103(A) 申请公布日期 2001.02.16
申请号 JP19990213643 申请日期 1999.07.28
申请人 NEC CORP 发明人 OBINATA HIDEO
分类号 H01L21/027;G03F1/20;G03F1/68;G03F1/80;(IPC1-7):H01L21/027;G03F1/16 主分类号 H01L21/027
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