Semiconductor device

摘要

A semiconductor device for mounting on an external substrate includes a semiconductor chip, a high thermal elastic internal substrate and a high elastic liquid resin. The semiconductor chip has bump electrodes formed on its main surface. The high thermal elastic internal substrate includes a conductive pattern on one surface and external electrodes on the other surface. The conductive pattern is electrically connected to the bump electrodes. The external electrodes are electrically connected to the conductive pattern and mounted on the external substrate. The high elastic liquid resin covers the surface of the semiconductor chip, the one surface of the internal substrate and the bump electrodes. The internal substrate has a Young modulus of about 8000 to 15000 kg/mm2, which is larger than a Young modulus of the external substrate.