| 摘要 |
<p>A method for making a semiconductor material, and subsequent structure, including providing a monocrystalline silicon substrate; epitaxially growing, using a source gas of GexHyClz for the germanium component, on the silicon substrate at a temperature in excess of 850 °C a graded Si1-xGex layer with increasing germanium concentration at a gradient of less than 25 % Ge per micron to a final composition in the range of 0.1<=x<=1; and epitaxially growing a layer of semiconductor material on the graded layer.</p> |
