| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and a device for holding a substrate with suction by which the influence of the coordinate error, shape error, etc., of a working pattern caused by the surface deformation of a substrate which occurs when the substrate is hold by suction on the working accuracy of the substrate can be reduced by improving the reproducibility of the error, and, in addition, the influence of the surface deformation of the substrate which occurs when the substrate is held at every shot. SOLUTION: On a chuck 1 which holds a substrate 100 with suction, projecting sections 2a for supporting the working areas of a substrate 100 placed on a placing base that supports the substrate 100 are arranged along, for example, the boundary lines 101 of the working areas of the substrate 100, so that a specific positional relation may be established and the sections 2a may support the working areas of the substrate 100 by the sane arrangement. Consequently, the surface deformation of the substrate 100 which occurs when the substrate 100 is held by suction can be put in order at every working area and the correction of the coordinate error, shape error, etc., of a pattern caused by the surface deformation of the substrate can be made easier by improving the reproducibility of the error between the working areas.</p> |
