| 摘要 |
During the cooling of high-temperature superconductor arrangements in which a polymer- composite-based electrically conducting transitional layer 3 is provided between a superconductor 1 and an electrical bypass 2, thermomechanical stresses occur in said transitional layer. To reduce these and to prevent the formation of cracks, the coefficient of thermal expansion of the transitional layer 3 is reduced. This takes place by adding a suitable filling material 32, for example particles of Si02, Al2O3 or AIN, to the polymer composite material.
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