| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide tweezers capable of stably holding large-diameter wafer. SOLUTION: The tweezers 10 for a wafer has a pair of clipping pieces 11, 12. Tips of the clipping pieces make curves 13, 14 annularly extending along the outer periphery of the wafer. These annular tips have a length of 1/4 to 1/6 of the outer periphery of the wafer, and friction member of high friction coefficient on the surface opposite to the wafer. The tweezers can hold the wafer by making one portion of the clipping pieces come closer to another when one clipping piece is separated from another. On the other hand, the wafer held between these annular tips can be released by separating these annular tips of the clipping pieces with each other when one portion of the clipping pieces is separated from another.</p> |
