| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a high-speed, highly stable laser processing system concerning a laser processing apparatus provided for a large-scale glass substrate and the like, in which a focused point for processing is fed back to a subject substrate by measuring a warped amount in advance when occurred a gap of the focused point for processing caused by bending owing to an own weight of the glass substrate and the like, and in which a stable processing performance can be maintained. SOLUTION: The system is provided with a warp measuring portion 6 measuring a warped amount of a processing object in advance, a measuring and feedback controlling portion 2 determining a warped function showing the warped amount at a full range of the processed object, and Z axis portion 5 adjusting a focusing point of a laser beam on the object by moving an object lens focusing the laser beam for processing while referring to the warped function or by moving the object up and down.</p> |
