| 摘要 |
A non-contact smart card assembly and a method of manufacturing the same are disclosed. The non-contact smart card assembly includes a RF antenna for receiving and transmitting RF signals and an integrated circuit component for processing the RF signals. Both the RF antenna and the integrated circuit component are mounted to a substrate. The smart card assembly further includes a capacitor, which together with the RF antenna form a resonance circuit. The capacitor is electrically coupled to the RF antenna and the integrated circuit component using flip-chip bonding techniques, thereby increasing reliability of the smart card assembly. Further, because the smart card assembly can be manufactured by automated equipment, manufacturing costs are reduced.
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