| 摘要 |
PROBLEM TO BE SOLVED: To prevent reliability of a semiconductor device from lowering due to stripping of a metal wiring formed on a tape-like wiring board, in the semiconductor device, which comprises a semiconductor chip having outer electrodes connected through bump electrodes to the metal wiring. SOLUTION: The semiconductor device is composed of a semiconductor chip, a tape board having a conductive metal wiring and a protective film for protecting the metal wiring on the surface of an insulative tape material, bump electrodes for connecting outer electrodes of the semiconductor chip to the metal wiring on the tape board, and a sealing resin filled between the semiconductor chip and the tape board, and the top ends f the metal wiring are at a distance from its portions for connecting the bump electrode, as much as the stresses exerted on connections of the bump electrodes with the metal wiring are dispersed to lessen the stripping of the metal wiring form the tape material. |
