| 摘要 |
PROBLEM TO BE SOLVED: To provide a chamfering method for a wafer capable of maintaining a machining form and accuracy for a wafer. SOLUTION: In this chamfering method for the wafer, after the outer peripheral part of the wafer is ground, a notch is ground. In grinding the notch, the groove shape of a grinding wheel for a notch is made larger than the groove shape of a grinding wheel for the outer periphery so that the outer peripheral part of the already ground wafer is kept from being ground more than needed.
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