发明名称 METHOD FOR FORMING VIA HOLE OF INKJET PRINTER HEAD
摘要 PURPOSE: A method for forming a via hole of an inkjet printer head is provided to improve productivity by reducing a processing time of a via hole and to minimize a producing cost. CONSTITUTION: A method for forming a via hole in an inkjet printer comprises a first stage installing a bubble generating unit containing a heater around a via hole forming area; a second stage mounting a first mask layer(601) covering entire portion except the via hole forming area by being mounted on a side of a base plate; a third stage forming a second mask layer(602) covering the entire portion except the via hole forming area by being installed on the other side of the base plate; a forth stage forming a first well(110) of a specific depth on the via hole forming area by injecting a sand(19) of high speed and high pressure into a side portion of the base plate; a fifth stage forming a via hole by installing a second well(120) on the via hole forming area through injecting the sand of the high pressure and speed into the other side portion of the base plate; and a sixth stage removing the first and second masks.
申请公布号 KR20020009828(A) 申请公布日期 2002.02.02
申请号 KR20000043339 申请日期 2000.07.27
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, RAE SU
分类号 B41J2/235;B24C1/00;B24C1/04;B41J2/05;B41J2/16;(IPC1-7):B41J2/235 主分类号 B41J2/235
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