发明名称 |
METHOD FOR FORMING VIA HOLE OF INKJET PRINTER HEAD |
摘要 |
PURPOSE: A method for forming a via hole of an inkjet printer head is provided to improve productivity by reducing a processing time of a via hole and to minimize a producing cost. CONSTITUTION: A method for forming a via hole in an inkjet printer comprises a first stage installing a bubble generating unit containing a heater around a via hole forming area; a second stage mounting a first mask layer(601) covering entire portion except the via hole forming area by being mounted on a side of a base plate; a third stage forming a second mask layer(602) covering the entire portion except the via hole forming area by being installed on the other side of the base plate; a forth stage forming a first well(110) of a specific depth on the via hole forming area by injecting a sand(19) of high speed and high pressure into a side portion of the base plate; a fifth stage forming a via hole by installing a second well(120) on the via hole forming area through injecting the sand of the high pressure and speed into the other side portion of the base plate; and a sixth stage removing the first and second masks. |
申请公布号 |
KR20020009828(A) |
申请公布日期 |
2002.02.02 |
申请号 |
KR20000043339 |
申请日期 |
2000.07.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK, RAE SU |
分类号 |
B41J2/235;B24C1/00;B24C1/04;B41J2/05;B41J2/16;(IPC1-7):B41J2/235 |
主分类号 |
B41J2/235 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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