| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that conventionally the penetration processes of an extra-fine good conductor for passing through an opening requires much time and hence cannot be mass-produced easily although an electronic substrate with a shorter pitch is obtained, and computer control, a precision machine, or the like allows the opening of a short pitch by an extra fine drill, an ultrasonic wave, a laser, or the like. SOLUTION: The extra-fine good conductor is not passed as a wire, but rather a metal conductor is filled into the opening of a resin plate for substrate that has already been opened as powder-like metal powder with improved conductivity, or as an appropriately conductive metal powder mixture in a slurry, a compound; and semi-viscosity shape by mixing a binder to the metal powder wt improved conductivity, microwaves or the like are applied for generating heat and for melting, and a linear appropriately conductive metal object is generated as a substitution for the penetration of a wire with improved conductivity.
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