| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method, having good heat dissipation characteristics for easily and efficiently radiating heat outside a package from a semiconductor integrated circuit chip, if this integrated circuit chip produces much heat during its operation. SOLUTION: The semiconductor device comprises outer leads 10a formed from a Cu base metal plate, a die pad 10b apart from the outer leads 10a, and radiation terminals 10c connected together to the die pad 10b. The radiation terminals 10c extend to two of four corners made with four sides of an arrangement of the outer leads 10a and form a region of a large area wider than that of the outer leads 10a. One of two IC chips, a first chip 22a having a comparatively high heating rate in operation is adhered to the die pad 10b surface through a conductive paste 24 having a high heat conductivity.</p> |
