OPTICAL PACKAGING SUBSTRATE, OPTICAL MODULE, OPTICAL TRANSMITTING AND RECEIVING DEVICE, OPTICAL TRANSMITTING AND RECEIVING SYSTEM AND MANUFACTURING METHOD OF THE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To solve the problem associated with the high cost of silicon substrate process and a complex optical waveguide manufacturing process which are required to realize giga bit class high speed operations for an optical module employing a conventional PLC platform. SOLUTION: An optical waveguide groove 11 is provided on a glass substrate 17 which has a lower loss in high frequency. Moreover, via holes 12 are provided in the thickness direction of the substrate for wiring connections or heat radiation.