LAMINATION PACKAGING METHOD OF SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide the lamination packaging method of a semiconductor chip for reducing heat history applied to a junction section in the lamination packaging of the semiconductor chip, making uniform a reaction layer along with each lamination layer, and improving reliability. SOLUTION: In the lamination packaging method of the semiconductor chip 1 for successively laminating a plurality of semiconductor chips 1 having solder 4, the solder 4 of the opposing semiconductor chips 1 is activated, the opposing semiconductor chips 1 are aligned, the semiconductor chips 1 that oppose one another by pressurization are laminated and joined without forming any solder junction layers 5, and a group of semiconductor chips is collectively heated to form the solder junction layers 5 after the lamination junction of all the semiconductor chips 1 is completed.