SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a structure of a semiconductor device which realizes low power consumption even if the screen is enlarged and to provide its manufacturing method. SOLUTION: The surface of the source wiring 126 of a pixel part 205 is plated to reduce the resistance of the wiring. The source wiring 126 of the pixel part is prepared by using a process different from that of the source wiring of the driving circuit part. Moreover, the electrode of the terminal is also plated to reduce the resistance.