| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, which can efficiently manufacture the semiconductor device where a thinned semiconductor element is easily treated, and to provide the semiconductor device. SOLUTION: In the method of manufacturing a semiconductor device 7, the semiconductor device 7 where a bumper member 4' larger than the semiconductor element 1' is jointed to the back of the electrode forming face of the semiconductor element 1' through a resin adhesion material 5 whose elastic coefficient is low is manufactured. A thinned semiconductor saver 1 and a bumper board 4 are jointed by the adhesion material 5 and the semiconductor wafer 1 is cut in cut width b1 by a first cutting tool 13A. Then, the bumper board 4 is cut by a second cutting tool 13B with a cutting width b2 narrower than the cutting width b1. Consequently, the semiconductor device 7 can efficiently be manufactured. |
