发明名称 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To efficiently form a solidified body on a surface of a substrate at low cost.SOLUTION: A formation process of a solidified body in which a liquid film of a solidification object liquid formed on the top surface of a substrate in a horizontal position is solidified using a cooling member thereby to form a solidified body includes: a first step of bringing a treatment surface at a temperature that is lower than a solidification point of the solidification object liquid in the cooling member into contact with the liquid film and solidifying the solidification object liquid positioned in a region sandwiched between the top surface and the treatment surface; and a second step of peeling the treatment surface from a solidified region solidified during the first step. An adhesion force between the solidified region and the treatment surface is less than that between the solidified region and the top surface.SELECTED DRAWING: Figure 6
申请公布号 JP2016181609(A) 申请公布日期 2016.10.13
申请号 JP20150061188 申请日期 2015.03.24
申请人 SCREEN HOLDINGS CO LTD 发明人 KITAGAWA HIROAKI;MIYA KATSUHIKO
分类号 H01L21/304;G03F1/82;H01L21/027 主分类号 H01L21/304
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