| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for producing a resin substrate, in which surface mountability, high-temperature stability, chemical resistance, adhesion and safety and hygiene at the time of production are improved, while reducing the size and cost by preventing open circuit at forming of a fine circuit, even is flaws (recesses) are produced on a resin molding, similar to a rough surface part. SOLUTION: The surface of a resin molding is irradiated sweepingly, at least partially, with laser light to form a rough surface part having a plurality of recesses arranged, at a substantially constant pitch, in the sweeping direction of laser light, thus forming a metal film on the rough surface part. In this method for producing a resin substrate, surface of the resin molding is coated with a film for preventing adhesion of the metal film, prior to sweeping of the surface of the resin molding with laser light; and thereafter, a rough surface part is formed on the surface of the resin molding, by sweeping a laser beam on the surface, thus forming the metal film only at the rough surface part.</p> |
