| 摘要 |
PROBLEM TO BE SOLVED: To provide a halogenated compound and an antimony oxide-free rein composition for sealing excellent in flame resistance, continuous productivity and moisture resistance, and to provide and a semiconductor-sealed device. SOLUTION: This resin composition for sealing includes (A) 60 to 90 wt.% based on the total resin composition, of an inorganic filler having maximum particle diameter <=200μm and average particle diameter 1 to 60μm, (B) a thermosetting resin, (C) a hardening agent, (D) 0.1 to 10 wt.% of a phosphazene compound and (E) 0.1 to 2 wt.% of a magnesium/aluminum based ion exchanging material as the essential components. And the semiconductor-sealed device obtained by sealing a semiconductor tip with a hardened product of the resin composition for sealing.
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